Part number:
BGS110MN20E6327XTSA1
射频集成电路
Infineon
form factor 2.3
20-WFQFN Exposed Pad
RoHS
YES
TYPE | DESCRIPTION |
Manufacturer Part Number: | BGS110MN20E6327XTSA1 |
Rohs Code: | Yes |
Part Life Cycle Code: | Obsolete |
Ihs Manufacturer: | INFINEON TECHNOLOGIES AG |
Package Description: | BCC, |
Reach Compliance Code: | compliant |
HTS Code: | 8542.39.00.01 |
Factory Lead Time: | 1 Week |
Manufacturer: | Infineon Technologies AG |
Risk Rank: | 7.99 |
JESD-30 Code: | S-XBCC-B20 |
Length: | 2.3 mm |
Moisture Sensitivity Level: | 1 |
Number of Functions: | 1 |
Number of Terminals: | 20 |
Operating Temperature-Max: | 85 °C |
Operating Temperature-Min: | -30 °C |
Package Body Material: | UNSPECIFIED |
Package Code: | BCC |
Package Shape: | SQUARE |
Package Style: | CHIP CARRIER |
Peak Reflow Temperature (Cel): | NOT SPECIFIED |
Seated Height-Max: | 0.77 mm |
Supply Voltage-Nom: | 3.5 V |
Surface Mount: | YES |
Telecom IC Type: | TELECOM CIRCUIT |
Temperature Grade: | OTHER |
Terminal Form: | BUTT |
Terminal Pitch: | 0.4 mm |
Terminal Position: | BOTTOM |
[email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
Width: | 2.3 mm |