Part number:
USB3503AI-1-GL-TR
开关IC
Microchip
USB 2.0 HSIC Hi
25-UFBGA, WLCSP
RoHS
YES
TYPE | DESCRIPTION |
Manufacturer Part Number: | USB3503AI-1-GL-TR |
Rohs Code: | Yes |
Part Life Cycle Code: | Active |
Ihs Manufacturer: | MICROCHIP TECHNOLOGY INC |
Part Package Code: | BGA |
Package Description: | 1.97 X 1.97 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-25 |
Pin Count: | 25 |
Reach Compliance Code: | compliant |
ECCN Code: | 3A001.A.3 |
HTS Code: | 8542.31.00.01 |
Factory Lead Time: | 9 Weeks |
Manufacturer: | Microchip Technology Inc |
Risk Rank: | 1.05 |
Bus Compatibility: | I2C |
Clock Frequency-Max: | 52 MHz |
JESD-30 Code: | S-PBGA-B25 |
JESD-609 Code: | e1 |
Length: | 1.97 mm |
Moisture Sensitivity Level: | 1 |
Number of Terminals: | 25 |
Operating Temperature-Max: | 85 °C |
Operating Temperature-Min: | -40 °C |
Package Body Material: | PLASTIC/EPOXY |
Package Code: | VFBGA |
Package Equivalence Code: | BGA25,5X5,16 |
Package Shape: | SQUARE |
Package Style: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel): | 260 |
Power Supplies: | 1.8,3.3/5 V |
Qualification Status: | Not Qualified |
Seated Height-Max: | 0.62 mm |
Subcategory: | Bus Controllers |
Supply Current-Max: | 110 mA |
Supply Voltage-Max: | 2 V |
Supply Voltage-Min: | 1.6 V |
Supply Voltage-Nom: | 1.8 V |
Surface Mount: | YES |
Technology: | CMOS |
Temperature Grade: | INDUSTRIAL |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form: | BALL |
Terminal Pitch: | 0.4 mm |
Terminal Position: | BOTTOM |
[email protected] Reflow Temperature-Max (s): | 40 |
Width: | 1.97 mm |
uPs/uCs/Peripheral ICs Type: | BUS CONTROLLER, UNIVERSAL SERIAL BUS |