Part number:
LS1046ASE8MQA
微处理器
NXP USA Inc.
0.8mm ARM® Co
780-FBGA, FCBGA
RoHS
YES
TYPE | DESCRIPTION |
Factory Lead Time | 18 Weeks |
Package / Case | 780-FBGA, FCBGA |
Surface Mount | YES |
Operating Temperature | 0°C~105°C |
Packaging | Tray |
Series | QorIQ® Layerscape |
Published | 2016 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 780 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 250 |
Supply Voltage | 0.9V |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | S-PBGA-B780 |
Supply Voltage-Max (Vsup) | 0.93V |
Supply Voltage-Min (Vsup) | 0.87V |
Number of I/O | 76 |
Speed | 1.2GHz |
Core Processor | ARM® Cortex®-A72 |
Address Bus Width | 14 |
Boundary Scan | YES |
External Data Bus Width | 64 |
Ethernet | 10GbE (2), 2.5GbE (1), 1GbE (4) |
Number of Cores/Bus Width | 4 Core 64-Bit |
RAM Controllers | DDR4 |
USB | USB 3.0 (3) + PHY |
Bus Compatibility | I2C, PCI, SPI, UART, USB |
Security Features | Secure Boot, TrustZone® |
SATA | SATA 6Gbps (1) |
Length | 23mm |
Height Seated (Max) | 2.61mm |
RoHS Status | ROHS3 Compliant |