Part number:
BGS13S2N9E6327XTSA1
射频开关
Infineon Technologies
SP3T -40°C~8
9-XFLGA
RoHS
YES
TYPE | DESCRIPTION |
Factory Lead Time | 6 Weeks |
Package / Case | 9-XFLGA |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Packaging | Tape & Reel (TR) |
Published | 2016 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 9 |
HTS Code | 8542.39.00.01 |
Voltage - Supply | 1.8V~3.3V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Supply Voltage | 3V |
Terminal Pitch | 0.4mm |
Frequency | 3GHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-XBGA-B9 |
Circuit | SP3T |
Impedance | 50Ohm |
Frequency Range | 100MHz~3GHz |
Insertion Loss | 0.55dB |
Telecom IC Type | TELECOM CIRCUIT |
Isolation | 23dB |
Length | 1.1mm |
Height Seated (Max) | 0.4mm |
Width | 1.1mm |
RoHS Status | RoHS Compliant |