Part number:
SE97TL,128
Thermal Management
NXP USA Inc.
8-XFDFN Exposed
8-XFDFN Exposed Pad
RoHS
YES
TYPE | DESCRIPTION |
Mounting Type | Surface Mount |
Package / Case | 8-XFDFN Exposed Pad |
Surface Mount | YES |
Operating Temperature | -40°C~125°C |
Packaging | Tape & Reel (TR) |
Published | 2009 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Terminal Finish | Tin (Sn) |
Voltage - Supply | 3V~3.6V |
Reach Compliance Code | unknown |
Base Part Number | SE97 |
Function | Temp Monitoring System (Sensor), DIMM DDR Memory |
Body Length or Diameter | 3mm |
Body Breadth | 2 mm |
Output Type | I2C/SMBus |
Termination Type | SOLDER |
Number of Bits | 11 |
Accuracy | ±3°C(Max) |
Topology | ADC (Sigma Delta), Comparator, Register Bank |
Sensor Type | Internal |
Sensors/Transducers Type | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL |
Housing | PLASTIC |
Output Interface Type | 2-WIRE INTERFACE |
Output Alarm | Yes |
Sensing Temperature | -40°C~125°C |
Body Height | 0.5mm |
RoHS Status | ROHS3 Compliant |